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Advanced electron microscopy and multidimensional characterization, backed by instrument expertise and application support for research and industry.

Introducing the Next-Generation SPARC Spectral 3.0 Cathodoluminescence System

Electron microscopic topography imageMicroscopic topography and signal overlay image
Atomic Force Microscopy ImagingMicroscopic Element Distribution Image

Cathodoluminescence (CL) Solution

As a "deep-seated and accurate" microscopic characterization tool in the fields of materials science, semiconductors, and nanophotonics, cathodoluminescence (CL) technology has long faced application bottlenecks such as "high threshold, dependence on expert experience, and long scanning time".

The release of SPARC Spectral 3.0 is rewriting that.

At the 21st International Microscopy Congress (IMC21) in Liverpool, Dutch characterization equipment giant Delmic officially launched a new generation of flagship cathodoluminescence system, SPARC Spectral 3.0, to the world. It continues Delmic's iconic modular design while leapfrogging hardware speed, software automation, and multimodal correlation capabilities - from “expert proprietary tools” to “high-throughput, automatable, and more user-friendly” analytics platforms.

01| SPARC 3.0 Core Benefits:

Enabling nanoscale optical characterization: higher flux, greater stability, lower threshold of use.

Simplify workflows - one-click auto alignment, auto raster calibration

Significantly increased throughput - 2.3x faster hyperspectral scanning

Unlock linkage characterization - CL and PL together, FIB-SEM seamless switching

Future-proof upgradeable - modular body to support on-site installation of new modules

SPARC Spectral 3.0 Four Core Benefits

SPARC Spectral 3.0 Four Core Benefits

02| Hardware Highlights

SPARC SPECTRAL 3.02.3x faster hyperspectral scanning

CCD hardware triggered, 128 × 128 pixel scan reduced from 15.4 minutes to 6.5 minutes. Beam-sensitive samples can be scanned for higher resolution before degradation.

ODEMIS software acquisition interface (CCD hardware trigger)

ODEMIS software acquisition interface (CCD hardware trigger)

Hyperspectral scan speed-up: 15.4 minutes → 6.5 minutes

Hyperspectral scan speed-up: 15.4 minutes → 6.5 minutes

SPARC SPECTRAL 3.0

Up to three lasers (405/532/633 nm) are injected into the SEM cavity to achieve CL + PL nanoscale correlation under the same vacuum environment. Sensitive materials such as perovskites, organic semiconductors, etc. do not need to transfer samples between multiple instruments.

SPARC SPECTRAL 3.0Monochromated Photon Count PMT

Microsecond dwell time + subnanometer spectral selectivity, suitable for microLED defect screening and high-throughput quantitative mapping of specific wavelengths.

SPARC SPECTRAL 3.04 mm short working distance mirror

Compatible with FIB-SEM concentric points, CL characterization and FIB processing switching are smoother; low-voltage SEM imaging performance is better.

SPARC SPECTRAL 3.0Body and Stagebox Reconfiguration

The positioning accuracy of the Stagebox is 1.2 μm, and the retraction speed of the mirror is increased to 6 mm/s (4 times); the blind flange design supports on-site upgrading of PL modules, Lab Cube, etc.

PL module in situ (FPLM)

PL module in situ (FPLM)

03| Software Highlights (ODEMIS)

FunctionValue
One-click 3D mirror auto alignment~ 5 minutes to complete X/Y/Z alignment, eliminate operator differences
Automatic raster calibrationZero-order diffraction peak is centered at < 0.4 pixels, consistent across session data
Arbitrary Shape & Multiple ROIFit zircon grain, round microLED, support overnight unattended
Intelligent stitching collectionLarge wafer/geological mount automatic Z height compensation with consistent focus
Acquisition formulaExperimental parameter export/import to ensure repeatability

Overview of ODEMIS Software Features

Overview of ODEMIS Software Features

ConfigureTypical Applications
Spectral BGeology, Universal Materials, Platform Sharing (UV-NIR Broad Spectrum)
Spectral UWide bandgap materials, UVC LEDs, power electronics
Spectral VNanophotonics, microLEDs, perovskites, 2D materials
Spectral RLarge wafer/geological mount automatic Z height compensation with consistent focus

Use Case Demonstration

Delmic Cathodoluminescence Technology Series Products

SPARC Spectral 3.0

SPARC Spectral 3.0

SPARC Compact

SPARC Compact

JOLT

JOLT

Consultation Hotline: 021-3358 6350 | E-mail:info@xbound-tech.com

XBOUND Characterization Technology is committed to exploring the microscopic world boundaries, focusing on advanced electron microscopy and multi-dimensional characterization technology. Through innovative instrument platforms and professional solutions, electronic microscopy, in-situ analysis, photoelectric correlation and intelligent characterization technologies are connected, providing unlimited possibilities for scientific research and industrial innovation.At present, we mainly provide the following products: advanced SEM/TEM accessories such as Delmic cathodoluminescence in the Netherlands, NenoVision electron microscope atomic force microscope in the Czech Republic, and Waviks in-situ laser heating and light excitation system in the United States. At present, there is a demo experience center in Shanghai, and after-sales service covers the whole country.

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